BAS16LD

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© Nexperia B.V. 2010. All rights reserved.

Product data sheet

Rev. 1 — 12 October 2010

3 of 11

Nexperia

BAS16LD

Single high-speed switching diode

5.

Limiting values

[1] Device mounted on an FR4 PCB with 60 μm copper strip line.

[2] Tj =25 °C prior to surge.

[3] Reflow soldering is the only recommended soldering method.

6.

Thermal characteristics

[1] Device mounted on an FR4 PCB with 60 μm copper strip line.

[2] Reflow soldering is the only recommended soldering method.

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VRRM

repetitive peak reverse

voltage

-100

V

VR

reverse voltage

-

100

V

IF

forward current

[1]

215

mA

IFRM

repetitive peak forward

current

tp ≤ 0.5 μs;

δ≤

0.25

-500

mA

IFSM

non-repetitive peak forward

current

square wave

[2]

tp =1 μs-

4

A

tp =1ms

-

1

A

tp =1s

-

0.5

A

Ptot

total power dissipation

Tamb ≤ 25 °C

[1][3] -250

mW

Tj

junction temperature

-

150

°

C

Tamb

ambient temperature

−

55

+150

°

C

Tstg

storage temperature

−

65

+150

°

C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

[1][2] -

-

500

K/W