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Product data sheet

Rev. 01 — 25 April 2005

3 of 8

Philips Semiconductors

BAS40H

General-purpose Schottky diode in small SOD123F package

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Soldering point of cathode tab.

7.

Characteristics

[1]

Table 6:

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1] [2] -

-

330

K/W

thermal resistance from

junction to solder point

[3] -

-

70

K/W

Table 7:

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

forward voltage

[1] -

-

380

mV

[1] -

-

500

mV

[1] --1

V

reverse current

--1

µA

--10

µA

diode capacitance

-

-

5

pF