Data sheet  |  Item number: 2060-452/998-404

www.wago.com/2060-452/998-404

Subject to changes. Please also observe the further product documentation!

WAGO Kontakttechnik GmbH & Co. KG

Hansastr. 27

32423 Minden

Phone: +49571 887-0 | Fax: +49571 887-169

Email: info.de@wago.com | Web: www.wago.com

Do you have any questions about our products?

We are always happy to take your call at +49 (571) 887-44222.

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Note:

Application notes:

Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to application-

specific variables (component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure

product and process compatibility under actual manufacturing conditions.

Note:

Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.

Recommendation:

Recommendation for SMD stencil:

Material thickness, 150 µm. Pattern layout identical to solder pad layout.

Data

Electrical data

Ratings per IEC/EN 60664-1

Ratings per

IEC/EN 60664-1

Nominal voltage (III/3)

63 V

 

Rated surge voltage (III/3)

2.5 kV

 

Rated voltage (III/2)

160 V

 

Rated surge voltage (III/2)

2.5 kV

 

Nominal voltage (II/2)

320 V

 

Rated surge voltage (II/2)

2.5 kV

 

Rated current

9 A

 

Legend (ratings)

(III / 2) ≙ Overvoltage category III / Pollution degree 2

Approvals per UL 1977

Rated voltage UL 1977

320 V

 

Rated current UL 1977

9 A