ADV7340EBZ datasheet(18/88 Pages) AD

18 / 88 page

ADV7340/ADV7341

Rev. 0 | Page 18 of 88

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter1

Rating

VAA to AGND

−0.3 V to +3.9 V

VDD to DGND

−0.3 V to +2.3 V

PVDD to PGND

−0.3 V to +2.3 V

VDD_IO to GND_IO

−0.3 V to +3.9 V

VAA to VDD

−0.3 V to +2.2 V

VDD to PVDD

−0.3 V to +0.3 V

VDD_IO to VDD

−0.3 V to +2.2 V

AGND to DGND

−0.3 V to +0.3 V

AGND to PGND

−0.3 V to +0.3 V

AGND to GND_IO

−0.3 V to +0.3 V

DGND to PGND

−0.3 V to +0.3 V

DGND to GND_IO

−0.3 V to +0.3 V

PGND to GND_IO

−0.3 V to +0.3 V

Digital Input Voltage to GND_IO

−0.3 V to VDD_IO + 0.3 V

Analog Outputs to AGND

−0.3 V to VAA

Storage Temperature Range (TS)

−65°C to +150°C

Junction Temperature (TJ)

150°C

Lead Temperature (Soldering, 10 sec)

260°C

1 Analog output short circuit to any power supply or common can be of an

indefinite duration.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

The ADV7340/ADV7341 are high performance integrated

circuits with an ESD rating of <1 kV, and it is ESD sensitive.

Proper precautions should be taken for handling and assembly.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 12. Thermal Resistance1

Package Type

θJA

θJC

Unit

64-Lead LQFP

°C/W

1 Values are based on a JEDEC 4 layer test board.

The ADV7340/ADV7341 are Pb-free products. The lead finish is

100% pure Sn electroplate. The device is RoHS compliant,

suitable for Pb-free applications up to 255°C (±5°C) IR reflow

(JEDEC STD-20).

Each part is backward-compatible with conventional SnPb

soldering processes. The electroplated Sn coating can be

soldered with Sn/Pb solder paste at conventional reflow

temperatures of 220°C to 235°C.

ESD CAUTION

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