Publication Number S75WS-N_02

Revision A Amendment 2 Issue Date October 6, 2005

General Description

The S75WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists

of the following items:

One or more S29WS-N code Flash

RAM Type 4

One or more S29WS-N data Flash, or one or more S30MS-P ORNAND Flash

The products covered by this document are listed in the table below:

Distinctive Characteristics

MCP Features

Power supply voltage of 1.7 V to 1.95 V

High Performance

— 54 MHz, 66 Mhz, 80 MHz

Packages

—9 x 12 mm 84 ball FBGA

— 11 x 13 mm 115 ball FBGA

Operating Temperature

— Wireless, –25°C to +85°C

S75WS-N Based MCPs

Stacked Multi-Chip Product (MCP)

256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only

Simultaneous Read/Write, Burst-mode Flash Memory with

128 Mb (8M x 16-Bit) RAM Type 4 and

512 Mb (32M x 16-bit) Data Flash or 1Gb ORNAND Flash

Data Sheet

PRELIMINARY

Device

Code Flash

Density

RAM

Density

NOR Data Flash

Density

ORNAND Data Flash

Density

256 Mb

128 Mb

256 Mb

512 Mb

1024 Mb

S75WS256NDF

S75WS256NEG