S29GL-M datasheet(21/116 Pages) SPANSION

21 / 116 page

October 10, 2006 S29GL-M_00_B6

S29GL-M MirrorBitTM Flash Family

Data

Sheet

Notes:

1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.

2. This package is recommended for new designs using TSOPs.

3. TSOP package marking omits packing type designator from the ordering part number.

4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.

5. 100% Matte Sn is used for Pb-free TSOP plating.

6. SnBi is used for Pb-free TSOP plating.

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to

confirm availability of specific valid combinations and to check on newly released combinations.

Table 2. S29GL064M Ordering Options

S29GL064M Valid Combinations

Package Description

(Notes)

Device

Number

Speed

Option

Package, Material, &

Temperature Range

Model

Number

Packing

Type

S29GL064M

90, 10, 11

TAI, TFI

R0,R3,R4,R6,R7

0,2,3

(Note 1)

TS048 (2, 3, 5)

TSOP

R1,R2

TS056 (2, 3, 5)

TBI, TCI

R2,R7

FPT-48P-M19 (3, 6)

TAI, TDI

FPT-56P-M01 (3, 6)

BAI, BFI

R0,R3,R4,R5

FBE063 (4, 6)

Fine-Pitch BGA

FAI, FFI

R1,R2,R3,R4,R5

LAA064 (4)

Fortified BGA

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