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BLF246B 데이터시트(PDF) 3 Page - NXP Semiconductors |
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BLF246B 데이터시트(HTML) 3 Page - NXP Semiconductors |
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3 / 16 page ![]() 2000 Feb 04 3 Philips Semiconductors Product specification VHF push-pull power MOS transistor BLF246B LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor section unless otherwise specified VDS drain-source voltage − 65 V VGS gate-source voltage −±20 V ID drain current (DC) − 8A Ptot total power dissipation Tmb ≤ 25 °C total device; both sections equally loaded − 130 W Tstg storage temperature −65 +150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-mb thermal resistance from junction to mounting base total device; both sections equally loaded 1.35 K/W Rth mb-h thermal resistance from mounting base to heatsink total device; both sections equally loaded 0.25 K/W Fig.2 DC SOAR. (1) Current in this area may be limited by RDSon. (2) Tmb =25 °C. Total device; both sections equally loaded. handbook, halfpage 10−1 1 10 110 ID (A) VDS (V) 102 (1) 50 MRA932 (2) Fig.3 Power/temperature derating curves. (1) Continuous operation. (2) Short-time operation during mismatch. Total device; both sections equally loaded. handbook, halfpage 0 40 80 160 160 120 40 0 80 MGR738 120 Th (°C) Ptot (W) (2) (1) |
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