September 1992

9

Philips Semiconductors

Product specification

UHF power MOS transistor

BLF522

Fig.12 Component layout for 500 MHz class-B test circuit.

The circuit and components are situated on one side of the printed circuit board, the other side being fully

metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow rivets

for a direct contact between upper and lower sheets.

handbook, full pagewidth

strap

strap

strap

strap

rivets

(12x)

strap

strap

strap

strap

150 mm

70 mm

MBC217

andbook, full pagewidth

R3

+VDS

C11

C9

C10

C8

R1

C4

C6

C7

L3 L4

L2

L1

C5

C3

C1

C2

R2

C14

R5

L7

C12

L6

C15

C16

L5

L8

L9

C18

C19

C20

C13

L10

MBC218