August 1986

7

Philips Semiconductors

Product specification

HF/VHF power transistor

BLW86

The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully

metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu

straps are used for a direct contact between upper and lower sheets.

To minimize the dielectric losses, the ground plane under the interconnection of L7 and C7 has been removed.

Fig.9 Component layout and printed-circuit board for 175 MHz test circuit.

handbook, full pagewidth

MGP605

1888MJK

1888MJK

C1

C2

R1

C3a

C4

C5

R2

C7

C8

C3b

C6b

C6a

L8

L3

L2

L1

L5

L7

L6

+VCC

rivet

72

150

L4