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ADCMP605 데이터시트(PDF) 7 Page - Analog Devices |
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ADCMP605 데이터시트(HTML) 7 Page - Analog Devices |
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7 / 16 page ![]() ADCMP604/ADCMP605 Rev. 0 | Page 7 of 16 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADCMP604 TOP VIEW (Not to Scale) Q 1 Q 6 VEE 2 VCCI/VCCO 5 VP 3 VN 4 PIN 1 INDICATOR TOP VIEW (Not to Scale) ADCMP605 VCCO 1 VCCI 2 VEE 3 9 VEE 8 LE/HYS 7 SDN Figure 3. ADCMP604 Pin Configuration Figure 4. ADCMP605 Pin Configuration Table 5. ADCMP604 (SC70-6) Pin Function Descriptions Pin No. Mnemonic Description 1 Q Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN. 2 VEE Negative Supply Voltage. 3 VP Noninverting Analog Input. 4 VN Inverting Analog Input. 5 VCCI/VCCO Input Section Supply/Output Section Supply. VCCI and VCCO shared pin. 6 Q Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN. Table 6. ADCMP605 (LFCSP-12) Pin Function Descriptions Pin No. Mnemonic Description 1 VCCO Output Section Supply. 2 VCCI Input Section Supply. 3 VEE Negative Supply Voltage. 4 VP Noninverting Analog Input. 5 VEE Negative Supply Voltage. 6 VN Inverting Analog Input. 7 SDN Shutdown. Drive this pin low to shut down the device. 8 LE/HYS Latch/Hysteresis Control. Bias with resistor or current for hysteresis; drive low to latch. 9 VEE Negative Supply Voltage. 10 Q Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN, if the comparator is in compare mode. 11 VEE Negative Supply Voltage. 12 Q Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN, if the comparator is in compare mode. Heat Sink Paddle VEE The metallic back surface of the package is electrically connected to VEE. It can be left floating because Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be soldered to the application board if improved thermal and/or mechanical stability is desired. |
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