PCA8575_1

© NXP B.V. 2006. All rights reserved.

Objective data sheet

Rev. 01 — 30 November 2006

19 of 30

NXP Semiconductors

PCA8575

14. Package outline

Fig 22. Package outline SOT137-1 (SO24)

UNIT

A

max.

cD

(1)

E

(1)

(1)

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

2.65

0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

15.6

15.2

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT137-1

X

12

24

θ

A

D

Q

detail X

E

Z

c

L

13

(A )

3

A

y

0.25

075E05

MS-013

pin 1 index

0.1

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.61

0.60

0.30

0.29

0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

e

1

0

5

10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

99-12-27

03-02-19