PART NUMBER

PAD OR BALL FINISH

PART MARKING

PACKAGE TYPE

MSL RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4710EV-1#PBF

SAC305 (RoHS)

4710-1

e1

LGA with Presolder

4

–40°C to 125°C

LTM4710IV-1#PBF

SAC305 (RoHS)

4710-1

e1

LGA with Presolder

4

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature

ranges. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

LTM4710-1

2

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

All Pins Except GND and AGNDn ................. –0.3V to 6V

Operating Junction

Temperature (Note 2)............................. –40°C to 125°C

(Note 1)

ORDER INFORMATION

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Body Temperature .................250°C

(See Pin Functions, Package Pinout Description table)

A

B

C

D

E

F

G

TOP VIEW

H

J

K

L

M

N

P

R

T

U

V

LGA WITH PRESOLDER PACKAGE

162-PIN (12mm × 6mm × 3.54mm)

TJMAX = 125°C, θJA = 12.2°C/W, θJCTOP = 6.2°C/W, θJCBOT = 2.7°C/W

WEIGHT = 0.58g

NOTES:

1. θ VALUES ARE DETERMINED BY SIMULATION PER JESD-51 CONDITIONS.

2. θJA VALUE IS OBTAINED WITH DEMO BOARD.

3. REFER TO APPLICATIONS INFORMATION SECTION FOR LAB MEASURMENT AND DE-RATING INFORMATION.

1

2

3

4

5

6

7

8

9

NC

NC

RUN1

FB1

GND

NC

NC

SSTT1

COMP1b

NC

NC

NC

PG1

COMP1a

NC

VOSNS1

AGND1

MODE1

RT1

RUN2

FB2

SSTT2

COMP2b

PG2

COMP2a

MODE2

RT2

RUN3

FB3

SSTT3

COMP3b

AGND3

PG3

COMP3a

MODE3

RT3

RUN4

FB4

SSTT4

COMP4b

PG4

COMP4a

MODE4

RT4

VIN1

BANK6

BANK10

GND

BANK7

BANK8

BANK11

GND

BANK9

VOUT4

VOUT3

VOUT2

VOUT1

BANK12

GND

AGND2

AGND4

BANK1

GND

GND

GND

GND

SW3

SW4

SW1

SW2

GND

BANK3

VIN2

BANK2

VIN1

BANK4

VIN3

BANK5

VIN4