Preliminary Technical Data

AD9211

Rev. PrA | Page 21 of 21

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2

a

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

8 x 8 mm Body, Very Thin Quad

(CP-56-2)

Dimensions shown in millimeters

PIN 1

INDICATOR

TOP

VIEW

7.75

BSC SQ

8.00

BSC SQ

1

56

14

15

43

42

28

29

4.45

4.30 SQ

4.15

0.50

0.40

0.30

0.30

0.23

0.18

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

6.50

REF

SEATING

PLANE

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

COPLANARITY

0.08

0.05 MAX

0.02 NOM

0.30 MIN

EXPOSED

PAD

(BOTTOM VIEW)

Figure 16. Mechanical Drawing (Subject to change)

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package Option

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package (LFCSP-VQ)

CP-56

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package (LFCSP-VQ)

CP-56

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package (LFCSP-VQ)

CP-56

AD9211-250EB

25°C

LVDS Evaluation Board with AD9211BCPZ-250

AD9211-200EB

25°C

LVDS Evaluation Board with AD9211BCPZ-200

AD9211-170EB

25°C

LVDS Evaluation Board with AD9211BCPZ-170

© 2006 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective companies.

Printed in the U.S.A.

PR06041-0-3/06(PrA)