LM5010AMH datasheet(3/17 Pages) NSC

3 / 17 page

Pin Descriptions

Pin Number

Name

Description

Application Information

LLP-10

TSSOP-14

Switching Node

Internally connected to the buck switch source.

Connect to the inductor, free-wheeling diode, and

bootstrap capacitor.

BST

Boost pin for bootstrap capacitor

Connect a capacitor from SW to the BST pin. The

capacitor is charged from VCC via an internal diode

during the buck switch off-time.

ISEN

Current sense

During the buck switch off-time, the inductor current

flows through the internal sense resistor, and out of

the ISEN pin to the free-wheeling diode. The current

limit comparator keeps the buck switch off if the

ISEN current exceeds 1.25A (typical).

SGND

Current Sense Ground

Re-circulating current flows into this pin to the

current sense resistor.

RTN

Circuit Ground

Ground return for all internal circuitry other than the

current sense resistor.

Voltage feedback input from the

regulated output

Input to both the regulation and over-voltage

comparators. The FB pin regulation level is 2.5V.

Softstart

An internal 11.5 µA current source charges the SS

pin capacitor to 2.5V to soft-start the reference input

of the regulation comparator.

RON/SD

On-time control and shutdown

An external resistor from VIN to the RON/SD pin

sets the buck switch on-time. Grounding this pin

shuts down the regulator.

VCC

Output of the bias regulator

The voltage at VCC is nominally equal to V

IN for VIN

< 8.9V, and regulated at 7V for V

IN > 8.9V.

Connect a 0.47 µF, or larger capacitor from VCC to

ground, as close as possible to the pins. An external

voltage can be applied to this pin to reduce internal

dissipation if V

IN is greater than 8.9V. MOSFET

body diodes clamp VCC to VIN if V

CC > VIN.

VIN

Input supply voltage

Nominal input range is 6V to 75V. Input bypass

capacitors should be located as close as possible to

the VIN pin and RTN pins.

1,7,8,14

No connection.

No internal connection. Can be connected to ground

plane to improve heat dissipation.

Exposed Pad

Exposed metal pad on the underside of the device.

It is recommended to connect this pad to the PC

board ground plane to aid in heat dissipation.

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