전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

SM0807RGB 데이터시트(PDF) 3 Page - Bivar, Inc.

부품명 SM0807RGB
상세설명  SURFACE MOUNT LED RED/GREEN/BLUE, 0807 PACKAGE
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  BIVAR [Bivar, Inc.]
홈페이지  https://www.bivar.com/
Logo BIVAR - Bivar, Inc.

SM0807RGB 데이터시트(HTML) 3 Page - Bivar, Inc.

  SM0807RGB Datasheet HTML 1Page - Bivar, Inc. SM0807RGB Datasheet HTML 2Page - Bivar, Inc. SM0807RGB Datasheet HTML 3Page - Bivar, Inc. SM0807RGB Datasheet HTML 4Page - Bivar, Inc. SM0807RGB Datasheet HTML 5Page - Bivar, Inc. SM0807RGB Datasheet HTML 6Page - Bivar, Inc.  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
Soldering Iron:
1. Temperature at tip of iron: 300̊C Max. (25W Max)
2. Soldering Time: 5 ± 1 sec.
Precautions for Use:
Customer must apply resistors for protection otherwise slight voltage shift will cause big current change, causing burnout.
Circuit Design
1. Customer must apply resistors for protection and stability. Circuit B in the diagram below is recommended. If
Circuit A is used, the current through the LEDs may vary due to the variation in Forward Voltage characteristics of
the LEDs, causing burn out to happen.
2. Current change may lead to LED color change. If there is a big difference among spectral color separation current
and actual service current, a color difference may occur.
3.
This product should be operated using forward current. Subjecting it to continuous reverse voltage may cause
migration, which may cause damage to the LED die.
Handling Precautions
1. When handling the product with tweezers, be careful to not apply excessive force to the resin. Otherwise, the
resin can be cut, chipped, delaminate, or deformed, causing wire-bond breaks.
2. Reflow Soldering must not be performed more than twice. Hand soldering must not be performed more than once.
3. When soldering, do not put stress on the LEDs during heating.
4. The product is sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
5. Do not stack assembled PCBs together. Stacking assembled PCBs can cause the resin to chip, delaminate,
and/or deform. This may lead to failure.
Bivar reserves the right to make changes at any time without notice.
Bivar, Inc. — 4 Thomas, Irvine, California 92618, U.S.A.
Revision A 8/21
Phone: (949) 951-8808 Fax: (949) 951-3974 E-mail: bivar@bivar.com Web: www.bivar.com
Page 3 of 6



Html Pages

1 2 3 4 5 6


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com