11

µPC1555

RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the

µPC1555.

Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under

different conditions.

Surface-Mount Devices

For details of the recommended soldering conditions, refer to our document

SMD Surface Mount Technology

Manual (IEI-1207).

µPC1555G2

Note

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: Temperature of 25

°C or less and maximum relative humidity of 65% or less

Caution Do not apply more than a single process at once, except for “Partial heating method.”

Through-Hole Mount Devices

µPC1555C

Soldering process

Soldering conditions

Symbol

Infrared reflow

Peak package’s surface temperature: 230

°C

IR30-00

Reflow time: 30 seconds or less (at 210

°C or more)

Maximum allowable number of reflow processes: 1

Exposure limit: NoneNote

VPS

Peak package’s surface temperature: 215

°C

VP15-00

Reflow time: 40 seconds or less (at 200

°C or more)

Maximum allowable number of reflow processes: 1

Exposure limit: NoneNote

Wave soldering

Temperature in the soldering vessel: 260

°C or less

WS60-00

Soldering time: 10 seconds or less

Maximum allowable number of reflow processes: 1

Exposure limit: NoneNote

Partial heating method

Pin temperature: 300

°C or less

Flow time: 10 seconds or less

Exposure limit: NoneNote

Soldering process

Soldering conditions

Wave soldering

Temperature in the soldering vessel: 260

°C or less

Soldering time: 10 seconds or less

REFERENCE

Document name

Document No.

NEC Semiconductor Device Reliability/Quality Control System

IEI-1212

Quality Grade on NEC Semiconductor Devices

IEI-1209

Semiconductor Device Mounting Technology Manual

IEI-1207

Semiconductor Device Package Manual

IEI-1213

Guide to Quality Assurance for Semiconductor Devices

MEI-1202

Semiconductor Selection Guide

MF-1134