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µµµµPC1677C

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(3) The bypass capacitor should be attached to VCC line.

(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in

accordance with desired frequency.

(5) The DC cut capacitor must be attached to input pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions.

For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

µµµµPC1677C

Soldering Method

Soldering Conditions

Recommended Condition

Symbol

Wave Soldering

Soldering bath temperature: 260°C or below

Time: 10 seconds or less

Count: 1, Exposure limit

Note: None

WS60-00-1

Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Caution

Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).