µPC667

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RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is performed under different conditions, please make sure to consult with our

sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(IEI-1207).

Through-hole device

µPC667CT: 30-pin plastic Shrink DIP (400 mil)

Process

Conditions

Wave soldering

Solder temperature: 260 ˚C or below,

(only to leads)

Flow time: 10 seconds or less.

Partial heating method

Terminal temperature: 300 ˚C or below,

Heat time: 3 seconds or less (Per each lead).

Caution For through-hole devices, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

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