Data Sheet G12649EJ5V0DS00

17

μPC494

RECOMMENDED SOLDERING CONDITIONS

The

μ PC494 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Through-hole Device

μ PC494C: 16-pin plastic DIP (7.62 mm (300))

Process

Conditions

Symbol

Wave Soldering

(only to leads)

Solder temperature: 260

°C or below, Flow time: 10 seconds or less

WS60-00

Partial Heating Method

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (Per each side of the device)

P300

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

Type of Surface Mount Device

μ PC494GS: 16-pin plastic SOP (7.62 mm (300))

Process

Conditions

Symbol

Infrared Ray Reflow

Maximum temperature (package’s surface temperature): 235

°C or below,

Time at maximum temperature: 10 seconds or less,

Time at temperature higher than 210

°C: 30 seconds or less,

Preheating time at 100 to 160

°C: 30 to 60 seconds, Times: 3 times,

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

IR35-00-3

Vapor Phase Soldering

Maximum temperature (package’s surface temperature): 215

°C or below,

Reflow time: 25 to 40 seconds or less (at 200

°C or higher),

Preheating time at 120 to 150

°C: 30 to 60 seconds, Times: 3 times,

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

VP15-00-3

Wave Soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Preheating temperature: 120

°C MAX. (Package surface temperature).

WS60-00-1

Partial Heating Method

Pin temperature: 350°C or below,

Heat time: 3 seconds or less (Per each side of the device),

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

P350

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

<R>