| 전자부품 데이터시트 검색엔진 |
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HT6P12 데이터시트(PDF) 3 Page - Holtek Semiconductor Inc |
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HT6P12 데이터시트(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 17 page ![]() Pad Assignment Chip size: 2580 × 2580 (µm)2 * The IC substrate should be connected to VSS in the PCB layout artwork. * The T4 pad must be bonded to VDD or VSS. * Other test pad (T1~T3, T5~T9) must be floating. HT6P12 3 2nd Oct ’97 |
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