µPD17P236

25

Data Sheet U14776EJ1V0DS00

6.

RECOMMENDED SOLDERING CONDITIONS

For the

µPD17P236 soldering must be performed under the following conditions.

For details of recommended conditions for surface mounting, refer to information document "Semiconductor

Device Mounting Technology Manual" (C10535E).

For other soldering methods, please consult with NEC personnel.

Table 6-1. Soldering Conditions of Surface Mount Type

(1)

µPD17P236M1GT: 28-pin plastic SOP (9.35 mm (375))

µPD17P236M2GT: 28-pin plastic SOP (9.35 mm (375))

µPD17P236M3GT: 28-pin plastic SOP (9.35 mm (375))

µPD17P236M4GT: 28-pin plastic SOP (9.35 mm (375))

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (210°C min.),

IR35-107-2

Number of times: 2 max. Number of days: 7

Note (after that, prebaking is

necessary at 125

°C for 10 hours)

<Caution>

Non-heat-resistant trays, such as magazine and taping trays, cannot be baked

before unpacking.

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (200°C min.),

VP15-107-2

Number of days: 7

Note (after that, prebaking is necessary at 125

°C for 10 hours)

<Caution>

Non-heat-resistant trays, such as magazine and taping trays, cannot be baked

before unpacking.

Wave soldering

Solder bath temperature: 260

°C max, Time: 10 seconds max., Number of times:

WS60-107-1

once, preheating temperature: 120

°C max. (package surface temperature)

Number of days: 7

Note (after that, prebaking is necessary at 125

°C for 10 hours)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per side of device)

—

Note

After opening the dry pack, store it at 25

°C or less and 6.5 % RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).