MCP6071T-ESLASHOT datasheet(12/42 Pages) MICROCHIP

12 / 42 page

MCP6071/2/4

DS20002142C-page 12

 2009-2021 Microchip Technology Inc. and its subsidiaries

3.0

PIN DESCRIPTIONS

Descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

3.1

Analog Outputs

The output pins are low-impedance voltage sources.

3.2

Analog Inputs

The noninverting and inverting inputs are high-

impedance CMOS inputs with low bias currents.

3.3

Power Supply Pins

The positive power supply (VDD) is 1.8V to 6.0V higher

than the negative power supply (VSS). For normal

operation, the other pins are at voltages between VSS

and VDD.

Typically, these parts are used in a single (positive)

supply configuration. In this case, VSS is connected to

ground and VDD is connected to the supply. VDD will

need bypass capacitors.

3.4

Exposed Thermal Pad (EP)

There is an internal electrical connection between the

Exposed Thermal Pad (EP) and the VSS pin; they must

be connected to the same potential on the Printed

Circuit Board (PCB).

MCP6071

MCP6072

MCP6074

Symbol

Description

SOIC

SOT-23-5 2x3 TDFN

SOIC

2x3 TDFN

SOIC,

TSSOP

VOUT, VOUTA Analog Output (op amp A)

VIN–, VINA– Inverting Input (op amp A)

VIN+, VINA+ Noninverting Input (op amp A)

VDD

Positive Power Supply

——

—

VINB+

Noninverting Input (op amp B)

——

—

VINB–

Inverting Input (op amp B)

——

—

VOUTB

Analog Output (op amp B)

——

—

VOUTC

Analog Output (op amp C)

——

—

VINC–

Inverting Input (op amp C)

——

—

VINC+

Noninverting Input (op amp C)

VSS

Negative Power Supply

——

—

VIND+

Noninverting Input (op amp D)

——

—

VIND–

Inverting Input (op amp D)

——

—

VOUTD

Analog Output (op amp D)

1, 5, 8

—

1, 5, 8

—

No Internal Connection

—

Exposed Thermal Pad (EP); must

be connected to VSS.

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