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DS20002269C-page 29

MCP65R41/6

Microchip Technology Drawing C04-028C (CH) Sheet 2 of 2

6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

protrusions shall not exceed 0.25mm per side.

1.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

2.

Notes:

REF: Reference Dimension, usually without tolerance, for information purposes only.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

Dimensioning and tolerancing per ASME Y14.5M

Foot Angle

Number of Leads

Pitch

Outside lead pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Lead Thickness

Lead Width

L1

φ

b

c

Dimension Limits

E

E1

D

L

e1

A

A2

A1

Units

N

e

0°

0.08

0.20

-

-

-

10°

0.26

0.51

MILLIMETERS

0.95 BSC

1.90 BSC

0.30

0.90

0.89

0.00

0.60 REF

2.90 BSC

0.45

2.80 BSC

1.60 BSC

1.15

-

-

MIN

6

NOM

1.45

1.30

0.15

0.60

MAX

Seating Plane to Gauge Plane

L1

0.25 BSC