HSMP-381F datasheet(8/12 Pages) HP

8 / 12 page

Figure 21. Internal Connections.

HSMP-489B

HSMP-481B

Typical Applications for HSMP-48XX Low Inductance Series

Figure 22. Circuit Layout.

Microstrip Series

Connection for

HSMP-48XB Series

In order to take full advantage of

the low inductance of the

HSMP-48XB series when using

them in series applications, both

lead 1 and lead 2 should be

connected together, as shown in

Figure 21.

Microstrip Shunt

Connections for

HSMP-48XB Series

In Figure 23, the center conductor

of the microstrip line is inter-

rupted and leads 1 and 2 of the

HSMP-48XB series diode are

placed across the resulting gap.

This forces the 0.5 nH lead induc-

tance of leads 1 and 2 to appear as

part of a low pass filter, reducing

the shunt parasitic inductance and

increasing the maximum available

attenuation. The 0.3 nH of shunt

inductance external to the diode is

created by the via holes, and is a

good estimate for 0.032" thick

material.

Figure 23. Circuit Layout.

50 OHM MICROSTRIP LINES

PAD CONNECTED TO

GROUND BY TWO

VIA HOLES

0.3 nH

0.3 pF*

1.5 nH

*0.8 pF TYPICAL FOR HSMP-482B

Figure 24. Equivalent Circuit.

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