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ICP1240 데이터시트(PDF) 13 Page - Microchip Technology

부품명 ICP1240
상세설명  6-18GHz 10W GaN PA MMIC
PDF  17 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

ICP1240 데이터시트(HTML) 13 Page - Microchip Technology

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6-18GHz 10W GaN PA MMIC
ICP1240
Engineering Datasheet Rev F
© 2023 Microchip Technology Inc.
and its subsidiaries
Page 13
Assembly Drawing
Optimum RF power performance achieved by
minimizing output RF bond wire length.
Interconnect assembly Notes
•
Ball Bonding is preferred technique
•
Force, time and ultrasonic parameters are
critical.
•
Aluminum wire bonding is not recommended.
•
Bond Wire diameter of 1mil is recommended.
Die attach of component using adhesive
•
Vacuum collets are preferred method of pickup.
•
Pickup method must consider the avoidance of
die air bridges.
•
Die suitable for Eutectic and Epoxy die attach.
•
Where Epoxy is used, high thermal conductivity
Silver Sintered Epoxy is recommended:-
•
Namics H9889–1
•
Kyocera CT2700R7S
Die attach using Eutectic
•
Flux-less gold-tin (AuSn) (80% Au, 20% Sn with
a melting point of 280ºC) preform is preferred
between the die and attached surface.
•
Recommended preform should be
approximately 0.0012” thick.
•
Die bonder using heated collet with a
temperature of 310ºC and die scrubbing should
be used to ensure wetting and prevent
formation of voids.
•
Exposure to extreme temperature should be
kept to a minimum.
•
The optimum die attach environment is nitrogen
atmosphere.
Reflow Process
•
Maximum temperature 320ºC for 30 seconds.
•
Material matching for coefficient of thermal
expansion is crucial for long-term reliability
Assembly Guidance
Application Circuits
PCB Construction
Material
Dimensions
METAL1_TOP
Cu + ENIG
1oz Cu plated
Electroless Nickel 3-5µm
DIELECTRIC
RO4350C
10mils (254µm)
METAL2_BOTTOM
Cu + ENIG
1oz Cu plated
Electroless Nickel 3-5µm
Key Features
Dimensions
VIA Drill
0.3mm
VIA Plating Thickness
50-70um
50 Ohm Line Width
525um
PCB Fabrication



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