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ELECTRICAL

Item

Requirement

Test Condition

Low Level Contact

Resistance

1).Initial:50 mΩ Max.

2).After Test:50 mΩ Max.

Subject mated contacts assembled in

housing to 20mA maximum open

circuit at 100mA.

The object of this test is to detail a

standard method to measure the

electrical resistance across a pair of

mated contacts such that the

insulating films, if present will not be

broken or asperity melting will not

occur

(EIA-364-23 or MIL-STD-1344A,

Method 3002.1, Test Condition B)

Insulation Resistance

Insulation Resistance: 1000 MΩ Min.

Apply a 500V DC between adjacent

terminals and between terminals to

ground.

(EIA-364-21 or MIL-STD-202F,

Method 302, Test Condition B)

Dielectric Withstanding

Voltage

500V AC for one minute at sea level

No flashover or insulation breakdown

Apply a voltage 500/530V AC for 1

minute between adjacent terminals

and between terminals to ground.

(EIA-364-20 or MIL-STD-202F,

Method 301, Test Condition B)

MECHANICAL

Item

Requirement

Test Condition

Connector Mating Force

0.3±0.15Kgf

Shall be measured with TENSION

GAUGE or TENSION TESTER.

Measure force necessary to mate

assemblies at maximum rate of

25mm per minute.

The object of this test is to detail a

standard method for determining the

mechanical forces required for

inserting a sim card connector.

(EIA-364-13)

Connector Unmating

Force

0.3±0.15Kgf

Shall be measured with TENSION

GAUGE or TENSION TESTER.

Measure force necessary to mate

assemblies at maximum rate of

25mm per minute.

The object of this test is to detail a

standard method for determining the

mechanical forces required for

inserting a sim card connector.