µPD4711B

11

Soldering Condition

Package peak temperature: 235 ˚C, Time: 30 seconds MAX.

(210 ˚C MIN.), Number of times: 2, Number of days: not limited*

Package peak temperature: 215 ˚C, Time: 40 seconds MAX.

(200 ˚C MIN.), Number of times: 2, Number of days: not limited*

Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds

MAX., Number of times: 1, Number of days: not limited*

Pin temperature: 300 ˚C MAX (lead temperature), Time: 3

seconds MAX. (per lead pin), Number of days: not

limited*

RECOMMENDED SOLDERING CONDITIONS

Soldering the

µPD4711B under the conditions listed in the table below is recommended.

For soldering methods and conditions other than those recommended, consult NEC.

Surface mount type

For the details of the recommended soldering conditions of the surface mount type, refer to Information

document “Semiconductor Device Mounting Technology Manual” C10535EJ7V0IF00.

µ PD4711BGS

Recommended Condition Symbol

IR35-00-2

VP15-00-2

WS60-00-1

* The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened.

Caution Do not use two or more soldering methods in combination (except the pin partial heating method).

Throught-hole type

µ PD4711BCX

Soldering Method

Soldering Conditions

Wave soldering

Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX.

Reference documents

“NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212)

“Quality Grade on NEC Semiconductor Devices” (IEI-1209)

“Semiconductor Device Mounting Technology Manual” C10535EJ7V0IF00

Soldering Method

Infrared reflow

VPS

Wave soldering

Pin partial heating