11

µPD4726

RECOMMENDED SOLDERING CONDITIONS

Solder and mount the

µPD4726 under the following recommended conditions.

Consult NEC for conditions other than those recommended.

µPD4726GS-BAF

Soldering method

Soldering conditions

Symbol

Infrared ray reflow

Peak temperature of package surface: 235

°C,

IR35-00-2

Reflow time: Within 30 sec (210

°C or higher),

Number of reflow process: 2, Exposure limit: None Note

VPS

Peak temperature of package surface: 215

°C,

VP15-00-2

Reflow time: Within 40 sec (200

°C or higher),

Number of reflow process: 2, Exposure limit: None Note

Wave soldering

Solder temperature: 260

°C or lower, Reflow time: Within 10 sec,

WS60-00-1

Number of reflow process: 1, Exposure limit: None Note

Partial heating

Pin temperature: 300

°C or lower, Time: Within 10 sec,

Exposure limit: None Note

Note

Exposure limit before soldering after dry-package is opened. Storage condition: 25

°C and relative humidity

at 65 % or less.

Caution

Do not use two or more soldering methods in combination (except the partial heating method).

REFERENCE

Document name

Document No.

Semiconductor Device Mounting Technology Manual

IEI-1207

Quality grade on NEC Semiconductor Devices

IEI-1209

NEC Semiconductor Device Reliability/Quality Control system

IEI-1212