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MP6606 데이터시트(PDF) 12 Page - Monolithic Power Systems

부품명 MP6606
상세설명  60V, 8-Channel Low-Side Driver with Serial Interface and Fault Indication
PDF  16 Pages
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제조업체  MPS [Monolithic Power Systems]
홈페이지  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP6606 데이터시트(HTML) 12 Page - Monolithic Power Systems

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MP6606
– 60V, 8-CHANNEL LOW-SIDE DRIVER WITH SERIAL INTERFACE
MP6606 Rev. 1.0
MonolithicPower.com
12
3/11/2022
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2022 MPS. All Rights Reserved.
APPLICATION INFORMATION
Selecting the External Components
The MP6606 requires a 100nF, X7R ceramic
bypass capacitor at the VIN pin. In addition,
place a larger-value ceramic capacitor (4.7µF at
minimum) nearby. Additional capacitance may
be recommended. For example, if the device is
located far away from the other capacitors
located at VIN, it is recommended to place an
electrolytic bulk capacitor at the input power
supply side.
The VCLAMP pin dissipates the energy in an
inductive load when the current is turned off.
Depending on the application, VCLAMP can be
connected directly to VIN, or to a TVS diode
that is also connected to VIN.
Connecting VCLAMP to VIN is equivalent to
connecting a diode from each output to VIN. A
TVS diode allows the voltage on the output pins
to rise above VIN until the TVS diode breaks
down. This increased voltage allows the current
through the load to decay faster. This is
typically recommended for applications with
high-speed operation using unipolar stepper
motors.
Select the TVS diode’s breakdown voltage such
that
the VCLAMP
pin
remains below
its
maximum ratings. Note that TVS breakdown
voltage may be higher than expected, as this
value is rated for lower currents.
For VIN supply voltages of up to 24V, a 24V
TVS diode is recommended. That ensures that
the VCLAMP pin voltage stays within its limits.
PCB Layout Guidelines
PCB layout is vital for stable operation. For the
best results, follow the guidelines below and
refer to Figure 5:
1. Place the bypass capacitors near the IC
2. Place the VCLAMP TVS diode (if used)
near the IC.
3. Place thermal vias under the exposed pad
to help dissipate heat from the device to a
plane either on the inner layer or on the
back side of the PCB.
Figure 5: Recommended PCB Layout



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