MPQ2169B

– 6V, DUAL 1.4A/1.4A OR 2A/0.8A SYNC BUCK REGULATOR, AEC-Q100

MPQ2169B Rev. 1.0

MonolithicPower.com

5

12/20/2021

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© 2021 MPS. All Rights Reserved.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ....................................6.5V

VSW .......................................-0.3V to VIN + 0.3V

All other pins............................... -0.3V to +6.5V

Junction temperature ............................... 150°C

Lead temperature .................................... 260°C

Storage temperature ................ -65°C to +150°C

Continuous power dissipation (TA = 25°C) (2) (6)

QFN-18 (2.5mmx3.5mm) ...........................3.6W

ESD Ratings

Human body model (HBM)..................Class 2 (3)

Charged device model (CDM)........Class C2b (4)

Recommended Operating Conditions

Supply voltage (VIN) .......................... 2.7V to 6V

Output voltage (VOUT)..................... 0.6V to 5.5V

Operating junction temp (TJ) (5) ..........................

…………………………………...-40°C to +125°C

Thermal Resistance

θJA

θJC

QFN-18 (2.5mmx3.5mm)

JESD51-7 (6).............................50……12….°C/W

EVQ2169B-RH-00A (7)...........34.8….2.7.....°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation can produce an excessive die

temperature, which may cause the regulator to go into

thermal

shutdown.

Internal

thermal

shutdown

circuitry

protects the device from permanent damage.

3) Per AEC-Q100-002.

4) Per AEC-Q100-011.

5) Operating devices at junction temperatures exceeding 125°C

is possible. Contact MPS for details.

6) Measured on JESD51-7, 4-layer PCB. The values given in

this table are only valid for comparison with other packages

and cannot be used for design purposes. These values were

calculated in accordance with JESD51-7, and simulated on a

specified

JEDEC

board.

They

do

not

represent

the

performance obtained in an actual application.

7) Measured

on

a

MPS

standard

EVB:

a

4-layer,

6.35cmx6.35cm PCB with 2oz thick copper.