MC34653EFSLASHR2 datasheet(16/24 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

34653

FUNCTIONAL DEVICE OPERATION

PROTECTION AND DIAGNOSIS FEATURES

Table 5. Thermal Resistance Data

Type

Condition

Symbol

Value

Unit

Junction to Ambient

Single-layer board (1s), per JEDEC jesd51-2 with board (JESD51-3) horizontal

RθJA

167

°C/W

Junction to Ambient

Four-layer board (2s2p), per JEDEC JESD51-2 with board (JESD51-3) horizontal

RθJMA

115

°C/W

Junction to Ambient

Single-layer board with a 300 mm2 radiator pad on its top surface, not standard JEDEC

–

145

°C/W

Junction to Ambient

Single-layer board with a 600 mm2 radiator pad on its top surface, not standard JEDEC

–

143

°C/W

Junction to Ambient

Four-layer board with a via for each thermal lead, not standard JEDEC

–

111

°C/W

Junction to Ambient

Four-layer board with a 300 mm2 radiator pad on its top surface and a full array of vias

between radiator pad and top surface, not standard JEDEC

–

107

°C/W

Junction to Ambient

Four-layer board with a 600 mm2 radiator pad on its top surface and a full array of vias

between radiator pad and top surface, not standard JEDEC

–

107

°C/W

Junction to Board

Thermal resistance between die and board per JEDEC JESD51-8

RθJB

°C/W

Junction to Case

Thermal resistance between die and case top

RθJC

°C/W

Junction to Package

Top

Temperature difference between package top and junction per JEDEC JESD51-2

°C/W

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