DA9011.001

28 Jan 2004

8 (9)

SOLDERING INFORMATION

◆ For Lead-Free TSOT-5

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20

Maximum Temperature

260

°C

Maximum Number of Reflow Cycles

3

Reflow profile

Thermal profile parameters stated in JESD22-A113 should not

Seating Plane Co-planarity

max 0.08 mm

Lead Finish

Solder plate 7.62 - 25.4 µm, material Matte Tin

TAPE & REEL SPECIFICATIONS (TSOT-5)

Other Dimensions according to EIA-481 Standard

3000 Components on Each Reel

Dimension

Min

Max

Unit

A

178

mm

B

1.5

mm

C

12.80

13.50

mm

D

20.2

mm

N

50

mm

8.4

9.9

mm

14.4

mm

7.9

10.9

mm

Trailer

160

mm

Leader

390,

of which minimum 160 mm of

empty carrier tape sealed with

cover tape

mm

A

B

D

W3

W2

C

W1

N

Feeding Direction

8 mm

4 mm