DA6282.001

9 January 2007

2 (5)

PIN DESCRIPTION

Pin Description MAS6282A

Symbol

x-coordinate

y-coordinate

Crystal/Varactor Oscillator Input

XIN

185

1229

Power Supply Voltage

VDD

436

1229

Serial Bus Data Input

DA

1071

1229

Serial Bus Clock Input

CLK

1342

1229

Buffer Output

OUT

1612

1229

Voltage Control Input

VC

209

152

Crystal Oscillator Output

XOUT

477

152

Temperature Output

TIN

780

152

Programming Input

PV

1071

152

Test Multiplexer Output

MOUT

1335

152

Power Supply Ground

VSS

1612

152

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

Note: Test Multiplexer Output is for testing only and must not be connected in module.

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Min

Max

Unit

Note

Supply Voltage

–0.3

5.5

V

Input Voltage

V

1)

Power Dissipation

20

mW

2)

Storage Temperature

–55

150

ESD Rating; HBM

±2

kV

3)

Latchup Current Limit

±100

mA

Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not

operate under these conditions, but it will not be destroyed

Note 1: Not valid for programming pin PV

Note 2: Value depends on a thermal resistance of the used packade

Note 3: In pins XIN and XOUT maximum ESD rating is 1 kV.