AD5821

Rev. 0 | Page 15 of 16

OUTLINE DIMENSIONS

SEATING

PLANE

0.50 BSC

BALL PITCH

1.575

1.515

1.455

1.750

1.690

1.630

0.28

0.24

0.20

0.36

0.32

0.28

0.65

0.59

0.53

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

3

B

C

BALL 1

IDENTIFIER

Figure 27. 9-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-9-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD5821BCBZ-REEL71

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package (WLCSP)

CB-9-1

D82

AD5821BCBZ-REEL1

−40°C to +85°C

9-Ball Wafer Level Chip Scale Package (WLCSP)

CB-9-1

D82

AD5821-WAFER

−40°C to +85°C

Bare Die Wafer

AD5821D-WAFER

−40°C to +85°C

Bare Die Wafer on Film

EVAL-AD5821EBZ1

Evaluation Board