6 (6)

DA9281.002

10 July 2006

ORDERING INFORMATION

Product Code

Output

Frequency

Crystal Load (pF)

Wafer thickness

Comments

MAS9281AATG00

9

215 µm

Tested, wafer

MAS9281ABTG00

9

215 µm

Tested wafer

MAS9281ACTG00

9

215 µm

Tested wafer

MAS9281ADTG00

9

215 µm

Tested wafer

MAS9281AETG00

9

215 µm

Tested wafer

MAS9281AGTG00

11

215 µm

Tested wafer

MAS9281AHTG00

11

215 µm

Tested wafer

MAS9281AJTG00

11

215 µm

Tested wafer

MAS9281AKTG00

11

215 µm

Tested wafer

MAS9281ALTG00

11

215 µm

Tested wafer

MAS9281ANTG00

14.5

215 µm

Tested wafer

MAS9281APTG00

14.5

215 µm

Tested wafer

MAS9281AQTG00

14.5

215 µm

Tested wafer

MAS9281ARTG00

14.5

215 µm

Tested wafer

MAS9281ASTG00

14.5

215 µm

Tested wafer

MAS9281ATTG00

14.5

215 µm

Tested wafer

MAS9281A0TG00

14.5

215 µm

Tested wafer

MAS9281A1TG00

14.5

215 µm

Tested wafer

MAS9281A2TG00

14.5

215 µm

Tested wafer

MAS9281A3TG00

14.5

215 µm

Tested wafer

MAS9281A4TG00

14.5

215 µm

Tested wafer

For product definitions see Application Information on page 5.

Contact Micro Analog Systems Oy for other wafer thickness options.

LOCAL DISTRIBUTOR

MICRO ANALOG SYSTEMS OY CONTACTS

Micro Analog Systems Oy

Kamreerintie 2, P.O. Box 51

FIN-02771 Espoo, FINLAND

Tel. +358 9 80 521

Fax +358 9 805 3213

http://www.mas-oy.com

NOTICE

Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or

performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits

shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no

claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and

Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or

modification.