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UPD703003A 데이터시트(PDF) 39 Page - Renesas Technology Corp

부품명 UPD703003A
상세설명  MOS INTEGRATED CIRCUIT
PDF  45 Pages
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제조업체  RENESAS [Renesas Technology Corp]
홈페이지  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPD703003A 데이터시트(HTML) 39 Page - Renesas Technology Corp

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µPD703003A, 703004A, 703025A, 703003A(A), 703025A(A)
Data Sheet U13188EJ6V1DS
5. RECOMMENDED SOLDERING CONDITIONS
The
µPD703003A, 703004A, 703025A, 703003A(A), and 703025A(A) should be soldered and mounted under the
following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 5-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
µPD703003AGC-33-×××-8EU:
100-pin plastic LQFP (fine pitch) (14
× 14)
µPD703004AGC-33-×××-8EU:
100-pin plastic LQFP (fine pitch) (14
× 14)
µPD703025AGC-33-×××-8EU:
100-pin plastic LQFP (fine pitch) (14
× 14)
µPD703003AGC(A)-33-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
µPD703025AGC(A)-33-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
IR35-107-2
VPS
VP15-107-2
Partial heating
—
Note After opening the dry pack, store it at 25
°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark
For soldering methods and conditions other than those recommended above, consult an NEC Electronics
sales representative.
Package peak temperature: 235
°C, Time: 30 seconds max. (at 210°C or
higher), Count: Two times or less, Exposure limit: 7 daysNote (after that,
prebake at 125
°C for 10 to 72 hours)
Package peak temperature: 215
°C, Time: 25 to 40 seconds (at 200°C or
higher), Count: Two times or less, Exposure limit: 7 daysNote (after that,
prebake at 125
°C for 10 to 72 hours)
Pin temperature: 300
°C max., Time 3 seconds max. (per pin row)



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