Data Sheet S15535EJ3V0DS

30

µPD720100A

4.

RECOMMENDED SOLDERING CONDITIONS

The

µPD720100A should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

µPD720100AGM-8ED: 160-pin plastic LQFP (Fine pitch) (24 × 24)

µPD720100AGM-8EY: 160-pin plastic LQFP (Fine pitch) (24 × 24)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Exposure limit: 3 days

Note (after that, prebake at 125°C for 10 hours)

IR35-103-3

Partial heating

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

µPD720100AGM-8EY-A: 160-pin plastic LQFP (Fine pitch) (24 × 24) Lead-free product

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),

Count: Three times or less

Exposure limit: 7 days

Note (after that, prebake at 125°C for 10 hours)

IR60-107-3

Partial heating

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

µPD720100AS1-2C: 176-pin plastic FBGA (15 × 15)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Exposure limit: 7 days

Note (after that, prebake at 125°C for 10 hours)

IR35-107-3

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

µPD720100AS1-2C-A: 176-pin plastic FBGA (15 × 15) Lead-free product

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),

Count: Three times or less

Exposure limit: 7 days

Note (after that, prebake at 125°C for 10 hours)

IR60-107-3

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.