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RT5713 데이터시트(PDF) 13 Page - Richtek Technology Corporation

부품명 RT5713
상세설명  Tiny, 360nA Low Quiescent Current, 0.5A/1A HCOT nanoPower Buck Converter
PDF  25 Pages
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제조업체  RICHTEK [Richtek Technology Corporation]
홈페이지  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT5713 데이터시트(HTML) 13 Page - Richtek Technology Corporation

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RT5713/14
Copyright © 2023 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
DS5713/14-03
March 2023
www.richtek.com
13
The maximum power dissipation depends on the
operating ambient temperature for the fixed TJ(MAX) and
the thermal resistance,
JA. The derating curves in
Figure 3 allows the designer to see the effect of rising
ambient
temperature
on
the
maximum
power
dissipation.
Figure 3. Derating Curve of Maximum Power
Dissipation
Layout Considerations
For high frequency switching power supplies, the PCB
layout is important to get good regulation, high
efficiency and stability. The following descriptions are
the guidelines for better PCB layout.
For good regulation, place the power components
as close as possible. The traces should be wide
and short enough especially for the high-current
loop.
Shorten the LX node trace length and make it wide.
Table 1. Protection Trigger Condition and Behavior
Protection Type
Threshold Refer to
Electrical Spec.
Protection Method
Reset Method
RT5713
UGATE Current Limit
ISW > 0.78A (Typ.)
Turn off UG MOS
ISW < 0.78A (Typ.)
LGATE Current Limit
ISW > 0.68A (Typ.)
Turn on LG MOS
ISW < 0.68A (Typ.)
RT5714
UGATE Current Limit
ISW > 1.2A (Typ.)
Turn off UG MOS
ISW < 1.2A (Typ.)
LGATE Current Limit
ISW > 1.2A (Typ.)
Turn on LG MOS
ISW < 1.2A (Typ.)
UVLO
VUVLOF < 1.9V (Typ.)
Shutdown
VUVLOR > 2V (Typ.)
OTP
Temperature > 150°C (Typ.)
Shutdown
Temperature < 130°C (Typ.)
0.0
0.5
1.0
1.5
2.0
2.5
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB
WL-CSP-6B 1.415x0.885 (BSC)
WDFN-6L 2x2



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