CS52015−1

http://onsemi.com

7

result can be substituted in equation (1).

based on an average die size. For a high current regulator

such as the CS52015−1 the majority of the heat is generated

package type, heat sink interface (is an insulator and thermal

grease used?), and the contact area between the heat sink and

the package. Once these calculations are complete, the

the proper heat sink selected. For further discussion on heat

sink

selection,

see

application

note

“Thermal

Management,” document number AND8036/D, available

through the Literature Distribution Center or via our website

at http://onsemi.com.

ADDITIONAL ORDERING INFORMATION

Orderable Part Number

Type*

Package

CS52015−1GT3

1.5 A, Adj. Output

TO−220−3, STRAIGHT

50 Units / Rail

CS52015−1GDP3

1.5 A, Adj. Output

50 Units / Rail

CS52015−1GDPR3

1.5 A, Adj. Output

750 / Tape & Reel

CS52015−1GST3

1.5 A, Adj. Output

SOT−223

80 Units / Rail

CS52015−1GSTR3

1.5 A, Adj. Output

SOT−223

2500 / Tape & Reel

*Consult your local sales representative for fixed output voltage versions.

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MARKING DIAGRAMS

52015−1

AWLYWW

1

AYW

52015

1

CS52015−1

AWLYWW

1

DP SUFFIX

CASE 418AB

SOT−223

ST SUFFIX

CASE 318E

TO−220−3

T SUFFIX

CASE 221A

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

CS