LIS3L02AL

Package Information

15/17

6

Package Information

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 20.

LGA-8 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A1

1.460

1.520

1.600 0.0574 0.0598 0.0629

A2

1.330

0.0523

A3

0.180

0.220

0.260

0.007 0.0086 0.0102

D1

4.850

5.000

5.150

0.190 0.1968 0.2027

E1

4.850

5.000

5.150

0.190 0.1968 0.2027

L

1.270

0.05

L1

2.540

0.1

M

1.225

0.0482

M1

0.875

0.900

0.925 0.0344 0.0354 0.0364

N

2.000

0.0787

N1

1.225

0.0482

N2

1.170

0.046

P1

1.300

1.350

1.400 0.0511 0.0531 0.0551

P2

0.740

0.790

0.840 0.0291 0.0311 0.033

T1

1.170

0.046

T2

0.615

0.640

0.665 0.0242 0.0251 0.0261

R

1.200

1.600 0.0472

0.0629

h

0.150

0.0059

k

0.050

0.0019

j

0.100

0.0039

LGA8 (5x5x1.6mm)

Land Grid Array Package

7669231 C

P1

DETAIL A

E

E1

(4x)

D

K

E

K

Detail A

D

E

4

3

2

1

A1

A2

A3

R

seating plane

5

6

7

8

M1

T1

M

hA

C

B

j

A

C

B

SOLDER MASK

OPENING

METAL PAD

B

A

K

K

C