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AS5116

Mechanical Data

Datasheet

• PUBLIC

DS000686

• v4-00 • 2022-Feb-18

34

│ 32

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Mechanical Data

Figure 42:

SOIC8 Die Placement and Hall Array Position

(1)

All dimensions in micrometers

(2)

The Hall array center is located in the center of the IC package. Hall array radius is 1.1 mm.

(3)

Die thickness is 356 µm nominal

(4)

Adhesive thickness 20 ± 10 µm

(5)

Leadframe downset 200 ± 25 µm

(6)

Leadframe thickness 200 ± 8 µm