| 전자부품 데이터시트 검색엔진 |
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MC7809ACTG 데이터시트(PDF) 21 Page - ON Semiconductor |
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MC7809ACTG 데이터시트(HTML) 21 Page - ON Semiconductor |
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21 / 32 page ![]() MC7800, MC7800A, NCV7805 http://onsemi.com 21 Figure 12. Worst Case Power Dissipation versus Ambient Temperature (Case 221A) Figure 13. Input Output Differential as a Function of Junction Temperature (MC78XXC, AC, B) 20 16 12 8.0 4.0 0 −50 −25 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) qHS = 0°C/W 0.5 0 −75 −50 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) IO = 0 mA IO = 20 mA IO = 1.0 A IO = 500 mA IO = 200 mA DVO = 2% of VO − − − Extended Curve for MC78XXB qJC = 5°C/W qJA = 65°C/W TJ(max) = 150°C qHS = 5°C/W qHS = 15°C/W No Heatsink 2.0 1.5 1.0 2.5 Figure 14. D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length 30 40 50 60 70 80 1.0 1.5 2.0 2.5 3.0 3.5 0 102030 25 15 5.0 L, LENGTH OF COPPER (mm) PD(max) for TA = 50°C Minimum Size Pad 2.0 oz. Copper L L Free Air Mounted Vertically RqJA 40 50 60 70 80 90 100 0 0.4 0.8 1.2 1.6 2.0 2.4 010 20 30 25 15 5.0 L, LENGTH OF COPPER (mm) PD(max) for TA = 50°C Minimum Size Pad L L Free Air Mounted Vertically RqJA 2.0 oz. Copper Figure 15. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length |
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