VSC8541-02 datasheet(95/101 Pages) MICROCHIP

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VSC8541-02 데이터시트(PDF) 95 Page - Microchip Technology

부품명	VSC8541-02

상세설명	Single Port Gigabit Ethernet Copper PHY with GMII/RGMII/MII/RMII Interfaces

PDF	101 Pages

Scroll/Zoom	100%

제조업체	MICROCHIP [Microchip Technology]

홈페이지	http://www.microchip.com

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95 / 101 page

Package Information

VMDS-10513 VSC8541-02 Datasheet Revision 4.1

Package Information

The VSC8541XMV-02 package is a lead-free (Pb-free), 68-pin, plastic quad flat no-lead (QFN) package

with an exposed pad, 8 mm × 8 mm body size, 0.4 mm pin pitch, and 0.9 mm maximum height.

Lead-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC

and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.

This section provides the package drawing, thermal specifications, and moisture sensitivity rating for the

VSC8541-02 device.

7.1

Package Drawing

The following illustration shows the package drawing for the VSC8541-02 device. The drawing contains

the top view, bottom view, side view, dimensions, tolerances, and notes.

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