WM8753LGEBSLASHV datasheet(91/92 Pages) WOLFSON

91 / 92 page

WM8753L

Pre-Production

PP Rev 3.4 November 2005

PACKAGE DIAGRAM - 52-BALL BGA

DM034.A

B: 52 BALL BGA PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

0.10

2 X

DETAIL 2

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.

3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.

4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

0.27

0.21

0.15

0.35

0.25

5.00 BSC

4.00 BSC

0.50 BSC

5.00 BSC

4.00 BSC

0.30

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.95

1.11

1.27

0.80

0.90

1.00

ccc

0.10

2 X

aaa

bbb

DETAIL 1

SOLDER BALL

ddd

0.10

aaa

bbb

ccc

0.80

0.15

Tolerances of Form and Position

ddd

0.05

DETAIL 1

BOTTOM VIEW

WM8753LGEB/V 데이터시트(PDF) 91 Page - Wolfson Microelectronics plc

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