WM8940 datasheet(84/85 Pages) WOLFSON

84 / 85 page

WM8940

Pre-Production

Pre-Production, Rev 3.0, February 2007

PACKAGE DIAGRAM

DM035.C

FL: 24 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.9 mm BODY, 0.50 mm LEAD PITCH

INDEX AREA

(D/2 X E/2)

TOP VIEW

NOTES:

1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.

3. ALL DIMENSIONS ARE IN MILLIMETRES.

4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.

5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.

8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

Exposed lead

Half etch tie bar

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.80

0.90

1.00

0.05

0.02

0.20 REF

0.30

0.18

4.00

2.25

2.15

2.00

0.50 BSC

0.30

0.40

0.50

4.00

2.25

2.15

2.00

0.10

aaa

bbb

ccc

REF:

0.15

0.10

JEDEC, MO-220, VARIATION VGGD-2.

Tolerances of Form and Position

0.25

0.1

0.213

0.1

0.2

DETAIL 1

DETAIL 2

bbb M

BOTTOM VIEW

aaa

2 X

aaa

2 X

SEATING PLANE

DETAIL 2

0.08

ccc

SIDE VIEW

0.15

0.03

EXPOSED

GROUND

PADDLE

DETAIL 1

0.32mm

degrees

EXPOSED

GROUND

PADDLE

Datum

DETAIL 2

Terminal

tip

e/2

SEE DETAIL 2

WM8940 데이터시트(PDF) 84 Page - Wolfson Microelectronics plc

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