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AD8337BCPZ-R2 데이터시트(PDF) 24 Page - Analog Devices

부품명 AD8337BCPZ-R2
상세설명  General-Purpose, Low Cost, DC-Coupled VGA
PDF  24 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
Logo AD - Analog Devices

AD8337BCPZ-R2 데이터시트(HTML) 24 Page - Analog Devices

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AD8337
Rev. B | Page 24 of 24
OUTLINE DIMENSIONS
1
EXPOSED
PAD
(BOTTOM VIEW)
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50
REF
0.50
0.40
0.30
2.75
BSC SQ
TOP
VIEW
12° MAX
0.70 MAX
0.65TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90 MAX
0.85 NOM
0.30
0.23
0.18
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.00
BSC SQ
5
8
EXPOSED PAD IS NOT CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
Figure 79. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding
AD8337BCPZ-R21
−40°C to +85°C
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
CP-8-2
HVB
AD8337BCPZ-REEL1
−40°C to +85°C
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
CP-8-2
HVB
AD8337BCPZ-REEL71
−40°C to +85°C
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
CP-8-2
HVB
AD8337BCPZ-WP1
−40°C to +85°C
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
CP-8-2
HVB
AD8337-EVALZ1
Evaluation Board with Noninverting Gain Configuration
AD8337-EVAL-INV
Evaluation Board with Inverting Gain Configuration
AD8337-EVAL-SS
Evaluation Board with Single-Supply Operation
1 Z = Pb-free part.
©2005-2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05575-0-2/07(B)



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