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AD8331ARQZ-R7 데이터시트(PDF) 39 Page - Analog Devices

부품명 AD8331ARQZ-R7
상세설명  Ultralow Noise VGAs with Preamplifier and Programmable RIN
PDF  40 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
Logo AD - Analog Devices

AD8331ARQZ-R7 데이터시트(HTML) 39 Page - Analog Devices

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AD8331/AD8332/AD8334
Rev. E | Page 39 of 40
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
14
1
8°
0°
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 95. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AD
20
11
10
1
PIN 1
8°
0°
0.010
0.004
0.012
0.008
0.025
BSC
COPLANARITY
0.004
0.065
0.049
0.069
0.053
SEATING
PLANE
0.010
0.006
0.050
0.016
0.345
0.341
0.337
0.158
0.154
0.150
0.244
0.236
0.228
Figure 96. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in Inches
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
Figure 97. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters



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