13

AT24C1024

1471N–SEEPR–12/05

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics

tables.

2. “U” designates Green Package & RoHS compliant.

3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Ordering Information

(1)

Ordering Code

Package

Operation Range

8CN1

8P3

8S2

8Y4

Lead-free/Halogen-free/

Industrial Temperature

(–40

°C to 85°C)

Die Sale

Industrial Temperature

(–40

°C to 85°C)

Package Type

8CN1

8-lead, 0.300" Wide, Leadless Array Package (LAP)

8P3

8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)

8S2

8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)

8Y4

8-lead, (6.00 x 4.90 mm Body) SOIC Array Package (SAP)

Options

–2.7

Low Voltage (2.7V to 5.5V)