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BYV4100 데이터시트(PDF) 3 Page - NXP Semiconductors |
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BYV4100 데이터시트(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1996 Oct 07 3 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifier BYV4100 ELECTRICAL CHARACTERISTICS Tj =25 °C unless otherwise specified. THERMAL CHARACTERISTICS Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.12. For more information please refer to the “General Part of associated Handbook”. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 3.5 A; Tj =Tj max; see Fig.5 −− 0.78 V IF = 3.5 A; see Fig.5 −− 0.98 V V(BR)R reverse avalanche breakdown voltage IR = 0.1 mA 120 −− V IR reverse current VR =VRRMmax; see Fig.8 −− 5 µA VR =VRRMmax; Tj = 165 °C; see Fig.8 −− 150 µA trr reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.10 −− 15 ns Cd diode capacitance f = 1 MHz; VR = 0 V; see Fig.9 − 245 − pF maximum slope of reverse recovery current when switched from IF = 1 A to VR ≥ 30 V and dIF/dt = −1A/µs; see Fig.11 −− 2A/ µs SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 25 K/W Rth j-a thermal resistance from junction to ambient note 1 75 K/W dI R dt -------- |
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