ATMEGA649 datasheet(3/375 Pages) ATMEL

3 / 375 page

ATmega329/3290/649/6490

2552H–AVR–11/06

Figure 2. Pinout ATmega329/649

Note:

The large center pad underneath the QFN/MLF packages is made of metal and internally

connected to GND. It should be soldered or glued to the board to ensure good mechani-

cal stability. If the center pad is left unconnected, the package might loosen from the

board.

Disclaimer

Typical values contained in this datasheet are based on simulations and characteriza-

tion of other AVR microcontrollers manufactured on the same process technology. Min

and Max values will be available after the device is characterized.

PC0 (SEG12)

(RXD/PCINT0) PE0

(TXD/PCINT1) PE1

LCDCAP

(XCK/AIN0/PCINT2) PE2

(AIN1/PCINT3) PE3

(USCK/SCL/PCINT4) PE4

(DI/SDA/PCINT5) PE5

(DO/PCINT6) PE6

(CLKO/PCINT7) PE7

(SCK/PCINT9) PB1

(MOSI/PCINT10) PB2

(MISO/PCINT11) PB3

(OC0A/PCINT12) PB4

(OC1B/PCINT14) PB6

(OC1A/PCINT13) PB5

PC1 (SEG11)

PG0 (SEG14)

PC2 (SEG10)

PC3 (SEG9)

PC4 (SEG8)

PC5 (SEG7)

PC6 (SEG6)

PC7 (SEG5)

PA7 (SEG3)

PG2 (SEG4)

PA6 (SEG2)

PA5 (SEG1)

PA4 (SEG0)

PA3 (COM3)

PG1 (SEG13)

INDEX CORNER

(SS/PCINT8) PB0

ATmega329/649

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